A new type of bioplastic has been designed, made from plant-based material and carbon fibre. It is not the only reason for getting catapulted to the headline. Interestingly, it can conduct heat higher than that of what stainless steel can. The new bioplastic can be used to make electronic products!
This will contirbute more towards the environment while solving the issue of releasing conventional heat as well. hats off to NEC Corporation for developing this amazing bioplastic. The plastic uses a cross-linked carbon fibre structure in the polylactic acid (PLA) resin. It achieves high heat diffusion.
Carbon fibre has 10 percent and 30 percent the heat diffusion ability of the new bioplastic composite.
It’s heat diffusion ability is double that of stainless steel. This enables good heat conductivity in the PLA resin board’s plane direction — a characteristic conventionally difficult to attain in metal boards.
NEC hopes that it will be able to start mass production of this new bioplastic composite by March 2009. It will be followed by using the composite in electronic products housing and other applications.
